Published 1989
| Version v1
Book
Hardening semiconductor components against radiation and temperature
- 1. Sandia National Labs., Albuquerque, NM (USA)
- 2. Jet Propulsion Lab. (USA)
- 3. Harry Diamond Lab. (USA)
- 4. Honeywell, Inc. (USA)
Description
This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects in electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology
Availability note (English)
Noyes Publications, Mill Road at Grand Ave., Park Ridge, NJ 07656 (USA).Additional details
Publishing Information
- Publisher
- Noyes Publications.
- Imprint Place
- Park Ridge, NJ (USA)
- ISBN
- 0-8155-1212-0
- Imprint Pagination
- 328 p.
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 21086267
- Subject category
- S36: MATERIALS SCIENCE; S36: MATERIALS SCIENCE; S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
- Descriptors DEI
- HARDENING; INTEGRATED CIRCUITS; PHYSICAL RADIATION EFFECTS; SILICON; SPECIFICATIONS
- Descriptors DEC
- ELECTRONIC CIRCUITS; ELEMENTS; RADIATION EFFECTS; SEMIMETALS