Published August 2016 | Version v1
Journal article

Heteroepitaxial growth of In0.30Ga0.70As high-electron mobility transistor on 200 mm silicon substrate using metamorphic graded buffer

  • 1. Low Energy Electronic Systems IRG (LEES), Singapore-MIT Alliance for Research and Technology, 1 CREATE Way, Singapore 138602 (Singapore)
  • 2. National University of Singapore, 21 Lower Kent Ridge Rd, Singapore 119077 (Singapore)
  • 3. Department of Materials Science and Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, MA 02139 (United States)
  • 4. School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 (Singapore)

Description

We report on the growth of an In0.30Ga0.70As channel high-electron mobility transistor (HEMT) on a 200 mm silicon wafer by metal organic vapor phase epitaxy. By using a 3 μm thick buffer comprising a Ge layer, a GaAs layer and an InAlAs compositionally graded strain relaxing buffer, we achieve threading dislocation density of (1.0 ± 0.3) × 107 cm−2 with a surface roughness of 10 nm RMS. No phase separation was observed during the InAlAs compositionally graded buffer layer growth. 1.4 μm long channel length transistors are fabricated from the wafer with IDS of 70 μA/μm and gm of above 60 μS/μm, demonstrating the high quality of the grown materials.

Additional details

Identifiers

Publishing Information

Journal Title
AIP Advances
Journal Volume
6
Journal Issue
8
Journal Page Range
p. 085106-085106.6
ISSN
2158-3226
CODEN
AAIDBI

Optional Information

Notes
(c) 2016 Author(s)