Published September 1, 2007
| Version v1
Journal article
Integration of GaAs epitaxial layer to Si-based substrate using Ge condensation and low-temperature migration enhanced epitaxy techniques
Creators
- 1. Department of Electrical and Computer Engineering, National University of Singapore, Singapore 119260 (Singapore)
- 2. Institute of Microelectronics, Singapore 117685 (Singapore)
- 3. Jusung Engineering, Kyunggi-Do 464-890 (Korea, Republic of)
Description
A GaAs defect-free epitaxial layer has been grown on Si via a Ge concentration graded SiGe on insulator (SGOI) for application in high channel-mobility metal-oxide-semiconductor field effect transistor. The SGOI layer, 42 nm thick, serves as the compliant and intermediate buffer to reduce the lattice and thermal expansion mismatches between Si and GaAs. A modified two-step Ge condensation technique achieves the surface Ge concentration in SGOI as high as 71%. It is also found that low-temperature migration enhanced epitaxy during the initial GaAs nucleation on the SGOI surface is critical to obtain a device quality GaAs layer by epitaxial growth
Additional details
Identifiers
- DOI
- 10.1063/1.2777401;
Publishing Information
- Journal Title
- Journal of Applied Physics
- Journal Volume
- 102
- Journal Issue
- 5
- Journal Page Range
- p. 054306-054306.6
- ISSN
- 0021-8979
- CODEN
- JAPIAU
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39074763
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CRYSTAL GROWTH; FIELD EFFECT TRANSISTORS; GALLIUM ARSENIDES; GERMANIUM SILICIDES; MOLECULAR BEAM EPITAXY; NUCLEATION; SEMICONDUCTOR MATERIALS; SUBSTRATES; THERMAL EXPANSION
- Descriptors DEC
- ARSENIC COMPOUNDS; ARSENIDES; CRYSTAL GROWTH METHODS; EPITAXY; EXPANSION; GALLIUM COMPOUNDS; GERMANIUM COMPOUNDS; MATERIALS; PNICTIDES; SEMICONDUCTOR DEVICES; SILICIDES; SILICON COMPOUNDS; TRANSISTORS
Optional Information
- Notes
- (c) 2007 American Institute of Physics