Published October 2016 | Version v1
Journal article

Evaluation of structural deformations of a mechanical connecting unit oxidizer supplies by thermo-mechanical simulation

Creators

  • 1. Dept. of Mechanical Engineering, Institute of Machine Convergence Technology, Hankyong National University, Anseong (Korea, Republic of)

Description

A Mechanical connecting unit (MCU) used in ground facilities for a Liquid propellant rocket (LPR) acts as a bridge between the onboard system and the ground oxidizer filling system. It should be resistant to structural deformations in order to guarantee successful supply of a cryogenic oxidizer and high pressure gases without reduction of sealing capability. The MCU consists of many components and linkages and operates under harsh conditions induced by a cryogenic oxidizer, high pressure gases and other mechanical forces. Thus, the evaluation of structural deformation of the MCU considering complex conditions is expensive and time consuming. The present study efficiently evaluates the structural deformations of the key components of the MCU by Thermo-mechanical simulation (TMS) based on the superposition principle. Deformations due to the mechanical loadings including weights, pressures, and spring forces are firstly evaluated by using a non-linear flexible body simulation module (FFlex) of Multi-body dynamics (MBD) software, RecurDyn. Then, thermal deformations for the deformed geometries obtained by RecurDyn were subsequently calculated. It was conducted by using a Finite element (FE) analysis software, ANSYS. The total deformations for the onboard plate and multi-channel plate in the connecting section due to the mechanical and thermal loadings were successfully evaluated. Moreover, the outer gaps at six points between two plates were calculated and verified by comparison to the measured data. Their values and tendencies showed a good agreement. The author concluded that the TMS using MBD software considering flexible bodies and an FE simulator can efficiently evaluate structural deformations of the MCU operating under the complex load and boundary conditions

Additional details

Publishing Information

Journal Title
Journal of Mechanical Science and Technology
Journal Volume
30
Journal Issue
10
Series
16 refs, 9 figs, 2 tabs
Journal Page Range
p. 4669-4677
ISSN
1738-494X

INIS

Country of Publication
Korea, Republic of
Country of Input or Organization
Korea, Republic of
INIS RN
48049449
Subject category
S42: ENGINEERING;
Descriptors DEI
BOUNDARY CONDITIONS; COMPUTER CALCULATIONS; CRYOGENICS; DEFORMATION; EFFICIENCY; FINITE ELEMENT METHOD; OXIDIZERS; SIMULATION
Descriptors DEC
CALCULATION METHODS; MATHEMATICAL SOLUTIONS; NUMERICAL SOLUTION