Published March 2003
| Version v1
Journal article
Computer modeling of ion implanted deuterium release from tungsten
Description
Computer modeling of hydrogen release from tungsten during and after ion implantation was made. The model was based on diffusion equation with hydrogen-defect interaction and desorption from the chemisorption state taken into account. One particular experiment on re-emission during implantation, desorption decay after implantation followed by programmed thermodesorption was thoroughly analyzed. Influence of the model parameters, such as diffusivity, solubility, the rate of defect production, maximum concentration of defects, binding energy, and activation energy for chemisorption was analyzed. The set of the best fit parameters was found that gave a good overall description of all three stages of the experiment
Additional details
Identifiers
- PII
- S0022311502014344;
Publishing Information
- Journal Title
- Journal of Nuclear Materials
- Journal Volume
- 313-316
- Journal Issue
- 3-4
- Journal Page Range
- p. 604-608
- ISSN
- 0022-3115
- CODEN
- JNUMAM
Conference
- Title
- 15. international conference on plasma-surface interactions in controlled fusion devices
- Acronym
- PSI-15
- Dates
- 26-31 May 2002
- Place
- Gifu (Japan)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 34053078
- Subject category
- S36: MATERIALS SCIENCE; S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ACTIVATION ENERGY; BINDING ENERGY; CHEMISORPTION; COMPUTERIZED SIMULATION; DEFECTS; DESORPTION; DEUTERIUM IONS; DIFFUSION; EMISSION; ION IMPLANTATION; SOLUBILITY; TUNGSTEN
- Descriptors DEC
- CHARGED PARTICLES; CHEMICAL REACTIONS; ELEMENTS; ENERGY; IONS; METALS; REFRACTORY METALS; SEPARATION PROCESSES; SIMULATION; SORPTION; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.