Published April 26, 1989 | Version v1
Patent

Limiter for thermonuclear device

Description

Multi-layered corrugated plates of low bending rigidity and high heat conductivity are disposed between limiter surface material and cooling pipes for cooling them. The multi-layered corrugated plates and the limiter surface materials, as well as the multi-layered corrugated plates and cooling pipes are respectively bonded metallurgically with each other. This can facilitate the bonding and the temperature of the limiter surface materials can be kept sufficiently low relative to the high temperature load from plasmas. Further, there is neither destruction of the limiter surface materials and the cooling pipes nor the crack at the metallurgical bonded faces and they can withstand high temperature load. (Y.Y.)

Availability note (English)

Available from JAPIO. Also available from INPADOC.

Additional details

Publishing Information

Imprint Pagination
3 p.
IPC:
Int. Cl. G21B1/00.
IPC
Int. Cl. G21B1/00.
Patent number
JP patent document 1-109293/A/

INIS

Country of Publication
Japan
Country of Input or Organization
Japan
INIS RN
20082031
Subject category
S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
Resource subtype / Literary indicator
Non-conventional Literature
Descriptors DEI
COOLING; FLEXIBILITY; HEAT TRANSFER; LIMITERS; METALLURGY; PIPES; PLASMA CONFINEMENT; PLATES; THERMAL STRESSES; TOKAMAK DEVICES; WELDED JOINTS
Descriptors DEC
CLOSED PLASMA DEVICES; CONFINEMENT; ENERGY TRANSFER; JOINTS; MECHANICAL PROPERTIES; STRESSES; TENSILE PROPERTIES; THERMONUCLEAR DEVICES

Optional Information

Secondary number(s)
JP patent application 62-266961.