Experimental research on the thermal conductivity of the contact pads for electronic equipment

Currently, soft contact pads of foreign manufacturers of SIL-Pad, Gap-Pad and Bond-Play series are widely used to transfer heat flows in electronic equipment elements. Within the framework of import substitution programs, the technology of manufacturing analogs of heat-conducting gaskets from local raw materials is being developed. The main thermal property that determines the performance of gaskets is the thermal conductivity. The article describes the installation, technique and methods of conducting and processing the results of experiments developed for its determination. The analysis of the obtained experimental data is made. (paper)