A high Reliability Module with Thermoelectric Device by Molding Technology for M2M Wireless Sensor Network
Creators
- 1. FUJITSU LABORATORIES LTD. 10-1 Morinosato-Wakamiya, Atsugi 243-0197 (Japan)
Description
This paper presents the fabrication of a new energy harvesting module that used the thermoelectric device (TED) by using molding technology. The output voltage per heater temperature of the TED module at 20 °C ambient temperature is 8mV/K and similar to the result with the aluminium heat sink which is almost the same fin size as the TED module. The accelerated environmental tests are performed on damp heat test that is an aging test under high temperature and high humidity, cold test and highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the electrical reliability in harsh environments. Every result of tests indicates that the TED and circuit board can be properly protected from harsh temperature and humidity by using molding technology, because the output voltage of after tested modules is reduced by less than 5%.This study presents a novel fabrication method for a high reliability TED-installed module appropriate for Machine to Machine wireless sensor networks
Availability note (English)
Available from http://dx.doi.org/10.1088/1742-6596/557/1/012014Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Physics. Conference Series (Online)
- Journal Volume
- 557
- Journal Issue
- 1
- Journal Page Range
- [5 p.]
- ISSN
- 1742-6596
Conference
- Title
- 14. International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications
- Acronym
- PowerMEMS 2014
- Dates
- 18-21 Nov 2014
- Place
- Awaji Island, Hyogo (Japan)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47014601
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ALUMINIUM; AMBIENT TEMPERATURE; ELECTRIC POTENTIAL; ENVIRONMENT; HEAT SINKS; HUMIDITY; MOLDING; RELIABILITY; SENSORS; TEMPERATURE RANGE 0400-1000 K; THERMOELECTRIC MATERIALS
- Descriptors DEC
- ELEMENTS; FABRICATION; MATERIALS; METALS; MOISTURE; SINKS; TEMPERATURE RANGE