Published November 27, 2014 | Version v1
Journal article

A high Reliability Module with Thermoelectric Device by Molding Technology for M2M Wireless Sensor Network

  • 1. FUJITSU LABORATORIES LTD. 10-1 Morinosato-Wakamiya, Atsugi 243-0197 (Japan)

Description

This paper presents the fabrication of a new energy harvesting module that used the thermoelectric device (TED) by using molding technology. The output voltage per heater temperature of the TED module at 20 °C ambient temperature is 8mV/K and similar to the result with the aluminium heat sink which is almost the same fin size as the TED module. The accelerated environmental tests are performed on damp heat test that is an aging test under high temperature and high humidity, cold test and highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the electrical reliability in harsh environments. Every result of tests indicates that the TED and circuit board can be properly protected from harsh temperature and humidity by using molding technology, because the output voltage of after tested modules is reduced by less than 5%.This study presents a novel fabrication method for a high reliability TED-installed module appropriate for Machine to Machine wireless sensor networks

Availability note (English)

Available from http://dx.doi.org/10.1088/1742-6596/557/1/012014

Additional details

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
557
Journal Issue
1
Journal Page Range
[5 p.]
ISSN
1742-6596

Conference

Title
14. International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications
Acronym
PowerMEMS 2014
Dates
18-21 Nov 2014
Place
Awaji Island, Hyogo (Japan)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47014601
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ALUMINIUM; AMBIENT TEMPERATURE; ELECTRIC POTENTIAL; ENVIRONMENT; HEAT SINKS; HUMIDITY; MOLDING; RELIABILITY; SENSORS; TEMPERATURE RANGE 0400-1000 K; THERMOELECTRIC MATERIALS
Descriptors DEC
ELEMENTS; FABRICATION; MATERIALS; METALS; MOISTURE; SINKS; TEMPERATURE RANGE