Published November 30, 2015 | Version v1
Journal article

Structural and phonon properties of InN synthesized by ion implantation in SiO2

  • 1. Centre de Développement des Technologies Avancées, Unité de Recherche en Photonique et Optique (CDTA,URPO), Sétif 19000 (Algeria)
  • 2. Laboratoire LPR, Département de Physique, Faculté des Sciences, Université de Annaba, BP 12, Annaba 23000 (Algeria)
  • 3. ICube, Université de Strasbourg UdS and CNRS (UMR7357), 23 rue du Loess, 67037 Strasbourg (France)
  • 4. Institut de Physique et Chimie des Matériaux de Strasbourg (IPCMS), UMR 7504 du CNRS, Université de Strasbourg UdS-ECPM, 23 Rue du Loess, 67034 Strasbourg (France)

Description

Ion-implantation is a powerful technique for the formation of compound semiconductor nanocrystal precipitates in a host medium. The aim is to elaborate quantum dots for device technology purposes. High dose (5.2 × 1016 ions/cm2) implantations of Indium (In) and Nitrogen (N) ions have been performed in a 206 nm thick SiO2 layer thermally grown on < 111 > silicon. The implantation energies have been chosen from 12 to 180 keV to produce 5–10 at.% profiles overlapping at a mean depth of about 100 nm. Thermal treatments between 500 °C and 900 °C for different annealing times lead to the formation of InN nanometric precipitates and to cure the oxide defects. In addition, the In2O3 and metallic indium phases have been observed. Their sizes, crystalline structures and depth distributions have been studied as a function of annealing temperature using grazing incidence X-ray diffraction, transmission electron microscopy, Rutherford back scattering spectrometry and Raman spectroscopy. - Highlights: • InN nanocrystals were formed by sequential ion implantation of In and N in SiO2. • The In2O3 and metallic indium phases have been found. • Redistribution of In occurs during post-implantation thermal annealing. • Three different InN family sizes were observed in the SiO2 layer.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2015.10.060

Additional details

Identifiers

DOI
10.1016/j.tsf.2015.10.060;
PII
S0040-6090(15)01053-6;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
595
Journal Issue
Part A
Journal Page Range
p. 108-112
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.