Published May 31, 2011 | Version v1
Journal article

Nano-scratching and nano-machining in different environments on Cr2N/Cu multilayer thin films

  • 1. Research Center for Micro/ Nanotechnology, Tungnan University, Taiwan (China)
  • 2. Institute of Mechatronic Engineering, Tungnan University, Taiwan (China)
  • 3. Department of Mechanical Engineering, Tungnan University, Taiwan (China)
  • 4. Center for Thin Film Technologies and Applications, Mingchi University of Technology, Taiwan (China)
  • 5. Department of Materials Engineering, Mingchi University of Technology, Taiwan (China)

Description

Five nanostructured Cr2N/Cu multilayer coatings were deposited by a bipolar asymmetric reactive pulsed DC magnetron sputtering system, and various bilayer periods (Λ) were achieved by controlling the holding time of Si substrates in the plasma of Cr or Cu. The hardness and elastic modulus of multilayer coatings were investigated by means of a nanoindenter. Nano-scratch and nano machining experiments on multilayered coatings were conducted using atomic force microscopy (AFM) in air and DI-water, respectively. According to the groove depth, width, and coefficient of friction (COF) obtained from nano-scratch tests, influences of scratch cycle numbers and bilayer periods on the scratchability of Cr2N/Cu multilayered thin films were examined. It was observed that after nano-scratch experiments in air and water, the COF values and the amount of removed material increased with increasing bilayer period. After nano-machining tests in air and water, different types of the cutting chip pile-ups were observed. In this work, the surface tribological properties and machinability of Cr2N/Cu multilayered thin films when using an AFM are discussed.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2011.01.067

Additional details

Identifiers

DOI
10.1016/j.tsf.2011.01.067;
PII
S0040-6090(11)00079-4;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
519
Journal Issue
15
Journal Page Range
p. 4992-4996
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
5. international conference on technological advances of thin films and coatings
Acronym
Thin Films 2010
Dates
12-14 Jul 2010
Place
Harbin (China)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
43050264
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
AIR; ATOMIC FORCE MICROSCOPY; CHROMIUM NITRIDES; COATINGS; HARDNESS; LAYERS; MAGNETRONS; NANOSTRUCTURES; PLASMA; SPUTTERING; SUBSTRATES; THIN FILMS; WATER
Descriptors DEC
CHROMIUM COMPOUNDS; ELECTRON TUBES; ELECTRONIC EQUIPMENT; EQUIPMENT; FILMS; FLUIDS; GASES; HYDROGEN COMPOUNDS; MECHANICAL PROPERTIES; MICROSCOPY; MICROWAVE EQUIPMENT; MICROWAVE TUBES; NITRIDES; NITROGEN COMPOUNDS; OXYGEN COMPOUNDS; PNICTIDES; TRANSITION ELEMENT COMPOUNDS

Optional Information

Copyright
Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.