Published January 2016 | Version v1
Journal article

Incorporation of microencapsulated dodecanol into wood flour/high-density polyethylene composite as a phase change material for thermal energy storage

  • 1. MOE Key Laboratory of Wooden Material Science and Application, Beijing Forestry University, Qinghua East Road 35, Haidian 100083, Beijing (China)
  • 2. Research Institute of Wood Industry, Chinese Academy of Forestry, Haidian 100091, Beijing (China)

Description

Highlights: • Various Microencapsulated phase change materials (MicroPCMs) were fabricated. • MicroPCMs in wood-plastic composites (WPCs) show good thermal performance. • The addition of MicroPCMs increases the impact strength and surface hardness of WPCs. • The decreased flexural and tensile properties are acceptable for some applications. Microencapsulated phase change materials (MicroPCMs) containing dodecanol were fabricated using in situ polymerization. Eight groups of wood flour/high-density polyethylene (WF/HDPE) composites with or without MicroPCMs were prepared. The synthesized MicroPCMs were characterized by scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FTIR), differential scanning calorimetry (DSC) and thermogravimetric (TG) analysis. Thermal and mechanical properties of the composites were investigated. The results showed that: (1) various MicroPCMs with different average diameters and core/shell ratios were prepared. The MicroPCMs were successfully incorporated into wood-plastic composites (WPCs) and there was little damage to MicroPCMs during processing; (2) both the melting–freezing temperatures (27.2, 11.3 °C) and the thermal stability (started to decompose at 256.9 °C) of MicroPCMs in composites had the potential for application in latent heat thermal energy storage (LHTES); and (3) the addition of MicroPCMs adversely affected flexural and tensile properties of WPCs but favored impact strength and surface hardness. The mechanical deterioration was acceptable for applications where mechanical properties are less important.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.matdes.2015.10.068

Additional details

Identifiers

DOI
10.1016/j.matdes.2015.10.068;
PII
S0264127515306468;

Publishing Information

Journal Title
Materials and Design
Journal Volume
89
Journal Page Range
p. 1325-1334
ISSN
0264-1275

Optional Information

Copyright
Copyright (c) 2015 Elsevier Ltd. All rights reserved.