Published August 11, 2008 | Version v1
Journal article Metadata-only

Effects of silver doping on electromigration of eutectic SnBi solder

Creators

  • 1. Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan (China)

Description

Effects of silver doping on electromigration behavior of the eutectic SnBi solder are investigated. Electromigration can induce the Bi migration along with the direction of electron flow in the eutectic SnBi solder, thus Bi depletes at the cathode side but accumulates at the anode side. Plate-like Ag3Sn compound is formed as 0.5 wt% silver is doped into the solder. The Ag3Sn plates behave like roadblocks which can intercept the Bi migration from the cathode side to the anode side. Consequently, a great inconsistency is found between the Bi depletion at the cathode side and the Bi accumulation at the anode side

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jallcom.2007.07.059

Additional details

Identifiers

DOI
10.1016/j.jallcom.2007.07.059;
PII
S0925-8388(07)01586-1;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
461
Journal Issue
1-2
Journal Page Range
p. 235-241
ISSN
0925-8388
CODEN
JALCEU

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
40014794
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ANODES; BISMUTH ALLOYS; CATHODES; DOPED MATERIALS; ELECTROPHORESIS; EUTECTICS; MIGRATION; SILVER; TIN ALLOYS
Descriptors DEC
ALLOYS; ELECTRODES; ELEMENTS; MATERIALS; METALS; TRANSITION ELEMENTS

Optional Information

Copyright
Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.