Published April 1, 2014 | Version v1
Journal article

Aluminum-doped zinc oxide sol–gel thin films: Influence of the sol's water content on the resistivity

  • 1. Institute for Solar Energy Research Hamelin (ISFH), Am Ohrberg 1, 31860 Emmerthal (Germany)
  • 2. Institute for Technical Chemistry, Gottfried Wilhelm Leibniz University Hannover, Callinstrasse 3A, 30167 Hannover (Germany)

Description

Thin films of indium tin oxide (ITO) have gained substantial interest due to their optical and electrical properties. Since ITO is an expensive material and indium is a rare element, considerable attempts have been made to replace it by, e.g., aluminum-doped zinc oxide (ZnO:Al). The production of ZnO:Al is less cost-intensive, especially if the sol–gel technique is applied, while its properties are comparable to those of ITO. In this study, we demonstrate that the electrical properties of ZnO:Al thin films can be improved considerably by the addition of small amounts of ultrapure water to the dip coating solution during the preparation. The lowest resistivity obtained with a film prepared from a sol containing 0.2 M water is 2.8·10−3Ωcm. Optical modeling thus indicates an improvement of the free carrier mobility of films prepared from sols in the presence of additional water. The films prepared have an average thickness of 340 nm and a solar transmittance above 85% after annealing in a forming gas atmosphere. Clearly, the addition of water to the sol has a positive impact on the resistivity of the final ZnO:Al thin film. We suggest the observed increase of the free carrier mobility to be due to an improved electron transfer at the grain boundaries between the spherical nanoparticles. - Highlights: • We prepared ZnO:Al thin films with additional water in the sol by dip coating. • We found a positive impact of the water in the sol on the resistivity of the film. • The free carrier concentration and mobility increased with additional 0.2 M water. • The refractive indices demonstrate a denser structure related to the water content

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2014.01.052

Additional details

Identifiers

DOI
10.1016/j.tsf.2014.01.052;
PII
S0040-6090(14)00083-2;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
556
Journal Page Range
p. 168-173
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.