Published February 2001 | Version v1
Journal article

The effect of high-temperature epitaxial SiC layer growth on the structure of porous silicon carbide

  • 1. Ioffe Physicotechnical Institute, Russian Academy of Sciences, Politekhnicheskaya ul. 26, St. Petersburg, 194021 (Russian Federation)

Description

Porous silicon carbide layers obtained by electrochemical etching of 6H-SiC at three anode current densities were investigated. X-ray double- and triple-crystal diffractometry and scanning electron microscopy were used to study the structure of porous SiC layers before and after high-temperature sublimation growth of 6H-SiC epilayers. The density of pores in the structure is found to be independent of the current density in electrochemical etching. The effective diameter of pores increases with increasing current density, resulting in higher porosity of the structure. High-temperature annealing modifies the structure without changing the sample porosity. The structural rearrangement is accompanied by coalescence of single pores and an increase in their diameter

Additional details

Identifiers

Publishing Information

Journal Title
Semiconductors
Journal Volume
35
Journal Issue
2
Journal Page Range
p. 153-157
ISSN
1063-7826
CODEN
SMICES

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
35051914
Subject category
S36: MATERIALS SCIENCE; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Numerical Data, Translation
Descriptors DEI
CRYSTAL STRUCTURE; ETCHING; EXPERIMENTAL DATA; LAYERS; MORPHOLOGY; POROUS MATERIALS; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDES; SILICON COMPOUNDS; X-RAY DIFFRACTION
Descriptors DEC
CARBIDES; CARBON COMPOUNDS; COHERENT SCATTERING; DATA; DIFFRACTION; ELECTRON MICROSCOPY; INFORMATION; MATERIALS; MICROSCOPY; NUMERICAL DATA; SCATTERING; SILICON COMPOUNDS; SURFACE FINISHING

Optional Information

Notes
Translated from Fizika i Tekhnika Poluprovodnikov, ISSN 0015-3222, 35, 159-163 (No. 2, 2001); (c) 2001 MAIK ''Nauka / Interperiodica''.