Beryllium microdeformation mechanisms

Microtensile and microcreep behaviors of beryllium were studied using a capacitance type extensometer capable of resolving .1 μm/m over long times. The nature of the dislocation processes responsible for microdeformation are not entirely clear; but surely, the primary difference between micro and conventional deformation is the extent to which the dislocations move and not the nature of the processes. Despite low temperatures, microcreep of Instrument Grade Beryllium appears to be diffusion limited. (author)