Published August 2009 | Version v1
Journal article

A study of defect evolution in multi-energy helium implanted monocrystalline and polycrystalline silicon

  • 1. Institute for Materials Research, University of Salford (United Kingdom)
  • 2. Laboratoire de Metallurgie Physique, UMR 6630, Universite de Poitiers, Futuroscope-Chasseneuill (France)
  • 3. Scottish Microelectronics Centre, University of Edinburgh (United Kingdom)
  • 4. Universite Francois Rabelais Tours, L.M.P, Tours (France)

Description

Upon implantation, He ions interact with radiation damage in metals and semiconductors to form bubbles (V. Raineri, Phys. Rev. B 2, 937 (2000)). As far as Si is concerned, recent literature contains much information on the effects of ion implantation, defect formation and the transport of point defects in He-irradiated crystalline silicon (c-Si) whereas little information exists on the effects of He implantation on polycrystalline Si (poly-Si). This paper reports on a systematic comparison of the effects of He implantation on c-Si and poly-Si. Interesting and significant differences were observed in the defect morphology in the two cases. Results on the differences between the two materials are presented and discussed in terms of the role that grain boundaries in poly-Si play in trapping interstitials and the effects that this may have on the overall defect morphology. (copyright 2009 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

Availability note (English)

Available from: http://dx.doi.org/10.1002/pssc.200881452

Additional details

Identifiers

Publishing Information

Journal Title
Physica Status Solidi. C, Current Topics in Solid State Physics (Print)
Journal Volume
6
Journal Issue
8
Journal Page Range
p. 1964-1968
ISSN
1862-6351

Conference

Title
International conference on extended defects in semiconductors
Acronym
EDS 2008
Dates
14-19 Sep 2008
Place
Poitiers-Futuroscope (France)

Optional Information

Notes
With 6 figs., 0 tabs., 18 refs.; SICI: 1862-6351(200908)6:8<1964::AID-PSSC200881452>3.0.TX;2-5