Preparation of Inorganic Filler Modified Epoxy Resin Adhesive and Study on Its Compatibility with UDMH

Epoxy resin adhesive have many advantages that other adhesives do not have, and are widely used in various fields. At the same time, it is also a thermosetting resin with high crosslinking density. Its cured product is brittle, low impact strength, and easy to crack. These shortcomings limit the further application of epoxy resin. This article takes the plugging agent of UDMH as the starting point. Epoxy resin adhesive toughened and modified with two kinds of inorganic fillers, nano-titania and micro-alumina, were prepared and study the compatibility of modified epoxy resin adhesive with UDMH. It is found that under certain conditions, the silane coupling agent KH570 can undergo a grafting reaction with the hydroxyl groups on the surface of nano-TiO₂ to improve its lipophilic and hydrophobic properties, and the effect is better than KH560, KH550; Through FT-IR, SEM, TG and other characterization methods, it is found that when the content of coupling agent is 15%, the effect of surface modification is the best. In the preparation of two kinds of inorganic filler modified epoxy adhesives, it is found that when the content of nano-TiO₂ is 3%, the toughening effect is the best, and the impact strength can reach 36.78 KJ/m2; When the content of micro alumina is 60%, the toughening effect is best, and the impact strength can reach 28.43 KJ/m2. In general, the toughening effect of using nano-TiO₂ is significantly better than that of alumina. In the study of the compatibility of the two kinds of filler modified epoxy resin adhesives with UDMH, it is found that when nano-titanium oxide is used as the filler, the compatibility of epoxy adhesive and UDMH is improved. However, when micro-alumina is used as the filler, the compatibility of epoxy resin adhesive and UDMH becomes worse. (paper)