Quality control and functionality tests during ATLAS IBL production

To improve performance of the ATLAS inner tracker, a fourth Pixel layer, called the Insertable B-layer (IBL), will be installed on a new beam pipe in 2014. This detector uses both conventional planar and 3D pixel sensors bump-bonded to a new readout chip, the FE-I4, in a novel stave design. Therefore, a production QA test bench has been established to test all production staves before integration with the new beam pipe. This setup combines former ATLAS Pixel services and a new readout system, namely the RCE (Reconfigurable Cluster Element) system developed at SLAC. With this setup all production staves will be tested to ensure the installation of only those staves which fulfill the IBL criteria. Quality assurance measurements under cleanroom conditions, including temperature and humidity control, are performed during the various production steps of the IBL, namely connectivity as well as electrical tests and signal probing on assembled subsystems. The capabilities of the stave qualification setup, and recent results from testing prototype staves are presented and discussed.