Published September 1, 2015 | Version v1
Journal article

The effect of metal-buffer bilayer drain/source electrodes on the operational stability of the organic field effect transistors

  • 1. Department of Electrical Engineering, University of Isfahan, Isfahan (Iran, Islamic Republic of)
  • 2. Department of Electrical and Avionics Engineering, Malek-Ashtar University of Technology, Isfahan (Iran, Islamic Republic of)

Description

In this paper, we have investigated experimentally the effect of different drain/source (D/S) electrodes and charge injection buffer layers on the electrical properties and operational stability of a stilbene organic field effect transistor (OFET). The results show that the organic buffer layer of copper phthalocyanine (CuPc) considerably improves the electrical properties of the transistors, but has a negligible effect on their temporal behavior. On the other hand, inorganic metal-oxide buffer layer of molybdenum oxide (MoO3) drastically changes both the electrical properties and operational stability. The functionalities of this metal-oxide tightly depend on the properties of the D/S metallic electrodes. OFETs with Al/MoO3 as the bilayer D/S electrodes have the best electrical properties: field effect mobility μeff = 0.32 cm2 V−1 s−1 and threshold voltage VTH = − 5 V and the transistors with Ag/MoO3 have the longest operational stability. It was concluded that the chemical stability of the metal/metal-oxide or metal/organic interfaces of the bilayer D/S electrodes determine the operational stability of the OFETs. - Highlights: • The effect of buffer layers on the performance of the stilbene OFETs has been investigated. • Inorganic buffer layer improved the electrical and temporal behaviors simultaneously. • Organic buffer layer only changes the electrical properties. • Chemical stability of the interfaces determines the operational stability of the transistor

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2015.07.079

Additional details

Identifiers

DOI
10.1016/j.tsf.2015.07.079;
PII
S0040-6090(15)00762-2;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
590
Journal Page Range
p. 214-218
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.