Published June 15, 2003 | Version v1
Journal article

Liquid carbon surface during explosive emission

Description

It has been established that the surface layer of carbon emitter is getting liquefied during an explosive electron emission (EEE) pulse to form very fine (on the scale of nanometers) tips with top curvature radii r<10 nm. Such tips are evenly distributed over the carbon emitter surface with a density on the order of 108 cm-2. One can surmise that it is these tips that secure a high stability and reproducibility of EEE from carbon emitter surfaces. A phenomenon of ''electropolishing'' of the carbon surface has been discovered which occurs when ions are extracted from the explosive emission plasma. It is experimentally demonstrated that taking off of the ion current gives rise to conditions ultimately resulting in a discontinuation of the formation of microprojections at the emitter surface, with the carbon emitter surface becoming more smooth ('polished'), and with the emergence of a new EEE cycle hampered

Additional details

Identifiers

DOI
10.1016/S0169-4332(03)00298-8;
arXiv
arXiv:0909.3209v1;
PII
S0169433203002988;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
215
Journal Issue
1-4
Journal Page Range
p. 286-290
ISSN
0169-4332
CODEN
ASUSEE

Conference

Title
4. IEEE international vacuum electron source conference
Acronym
IVESC 2002
Dates
15-19 Jul 2002
Place
Saratov (Russian Federation)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
38086719
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CARBON; ELECTRON EMISSION; ELECTROPOLISHING; FIELD EMISSION; LAYERS; PLASMA; SURFACES
Descriptors DEC
ELECTROLYSIS; ELEMENTS; EMISSION; LYSIS; NONMETALS; POLISHING; SURFACE FINISHING

Optional Information

Copyright
Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.