A novel fast and flexible technique of radical kinetic behaviour investigation based on pallet for plasma evaluation structure and numerical analysis
Creators
- 1. Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, ul. Koszykowa 75, Warsaw 00-662 (Poland)
- 2. Department of Electrical Engineering and Computer Science, Nagoya University, Furo-Cho, Chikusa-ku, Nagoya 464-8603 (Japan)
Description
This paper describes a new, fast, and case-independent technique for sticking coefficient (SC) estimation based on pallet for plasma evaluation (PAPE) structure and numerical analysis. Our approach does not require complicated structure, apparatus, or time-consuming measurements but offers high reliability of data and high flexibility. Thermal analysis is also possible. This technique has been successfully applied to estimation of very low value of SC of hydrogen radicals on chemically amplified ArF 193 nm photoresist (the main goal of this study). Upper bound of our technique has been determined by investigation of SC of fluorine radical on polysilicon (in elevated temperature). Sources of estimation error and ways of its reduction have been also discussed. Results of this study give an insight into the process kinetics, and not only they are helpful in better process understanding but additionally they may serve as parameters in a phenomenological model development for predictive modelling of etching for ultimate CMOS topography simulation. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0022-3727/46/26/265201Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Physics. D, Applied Physics
- Journal Volume
- 46
- Journal Issue
- 26
- Journal Page Range
- [11 p.]
- ISSN
- 0022-3727
- CODEN
- JPAPBE
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44120139
- Subject category
- S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
- Descriptors DEI
- ARGON FLUORIDES; EQUIPMENT; ETCHING; EVALUATION; FLEXIBILITY; FLUORINE; HYDROGEN; NUMERICAL ANALYSIS; PLASMA; REDUCTION; RELIABILITY; SIMULATION; THERMAL ANALYSIS; TOPOGRAPHY
- Descriptors DEC
- ARGON COMPOUNDS; ARGON HALIDES; CHEMICAL REACTIONS; ELEMENTS; FLUORIDES; FLUORINE COMPOUNDS; HALIDES; HALOGEN COMPOUNDS; HALOGENS; MATHEMATICS; MECHANICAL PROPERTIES; NONMETALS; RARE GAS COMPOUNDS; SURFACE FINISHING; TENSILE PROPERTIES