Changes in mass and stress during anodic oxidation and cathodic reduction of the Cu/Cu2O multilayer film

The anodic oxidation and cathodic reduction processes of the Cu/Cu2O multilayer film and pure Cu film in pH 8.4 borate buffer solution were analyzed by electrochemical quartz crystal microbalance (EQCM) for gravimetry and bending beam method (BBM) for stress measurement. The mass loss of the multilayer film during anodic oxidation at 0.8V (SHE) in the passive region was less than that of the pure Cu film. The comparison between current transients and mass changes during anodic oxidation has succeeded in separating the anodic current density into two partial current densities of oxide film growth, iO2-, and of Cu2+ dissolution through the passive film, iCu2+. As a result, in the case of the pure Cu film, the anodic current density was mainly due to iCu2+, while in the case of the multilayer film, iCu2+ was almost equal to iO2-. The compressive stress for the multilayer film was generated during anodic oxidation, while the tensile stress for the pure Cu film was generated. The mass loss of the multilayer film during cathodic reduction at a constant current density (ic=-20μAcm-2) was significantly less than that estimated from coulometry, suggesting that H2O produced by cathodic reduction remained in the multilayer film. The compressive stress was generated during cathodic reduction of the multilayer film, which was ascribed to H2O remained in the multilayer film