Published October 2007 | Version v1
Journal article

Temperature dependence of hydrogen isotope behaviors in non-He+ pre-implanted SiC and He+ pre-implanted SiC

  • 1. Radiochemistry Research Laboratory, Faculty of Science, Shizuoka University, 836 Ohya, Suruga-ku, Shizuoka 422-8529 (Japan)
  • 2. Department of Quantum Engineering and Systems Science, Graduate School of Engineering, University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656 (Japan)

Description

The implantation temperature dependence of hydrogen isotope behaviors in non-helium ion (He+) pre-implanted silicon carbide (SiC) and He+ pre-implanted SiC was studied by means of X-ray photoelectron spectroscopy (XPS) and thermal desorption spectroscopy (TDS). It was found that the deuterium (D) retention decreases as the implantation temperature increases in both non-He+ pre-implanted SiC and He+ pre-implanted SiC after D2+ implantation. Above 800 K, D bound only to C in forming C-D bonds. The chemical states of Si 2p for non-He+ pre-implanted SiC and He+ pre-implanted SiC at implantation temperatures above 800 K are quite different from those at room temperature and a positive peak shift of Si 2p was observed, indicating Si-C-D bonds were formed without larger amount of retention of damaged structures. These facts indicate that damaged structures introduced by D2+ and/or He+ implantation are quickly recovered by the thermal annealing effect at temperature above 800 K. These results imply that the thermal annealing effect influence widely on the tritium behavior and damaged structures in SiC

Availability note (English)

Available from http://dx.doi.org/10.1016/j.fusengdes.2007.06.033

Additional details

Identifiers

DOI
10.1016/j.fusengdes.2007.06.033;
PII
S0920-3796(07)00328-6;

Publishing Information

Journal Title
Fusion Engineering and Design
Journal Volume
82
Journal Issue
15-24
Journal Page Range
p. 2582-2587
ISSN
0920-3796
CODEN
FEDEEE

Conference

Title
24. symposium on fusion technology
Acronym
SOFT-24
Dates
11-15 Sep 2006
Place
Warsaw (Poland)

Optional Information

Copyright
Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.