Published March 24, 2003 | Version v1
Journal article

Cu-filled carbon nanotubes by simultaneous plasma-assisted copper incorporation

  • 1. State Key Laboratory for Surface Physics and International Center for Quantum Structures, Institute of Physics, Chinese Academy of Sciences, Beijing 100080 (China)

Description

Carbon nanotubes are filled with copper by means of chemical vapor deposition. Control of the density of copper in the plasma is crucial and is accomplished by adjusting the length of the copper electrodes that are exposed to the tungsten heating filament. Both simple and branched Cu-filled nanotubes were grown. Most of the branched nanotubes branch only once to form a regular trilateral starburst structure; others branch repeatedly in simple dendritic patterns. A model to account for the filling and growth characteristics is proposed based on observations made with a high-resolution transmission electron microscope and selected area electron diffraction

Additional details

Identifiers

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
82
Journal Issue
12
Journal Page Range
p. 1926-1928
ISSN
0003-6951
CODEN
APPLAB

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
35032396
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Numerical Data
Descriptors DEI
CARBON; CHEMICAL VAPOR DEPOSITION; COPPER; ELECTRON DIFFRACTION; EXPERIMENTAL DATA; ION IMPLANTATION; NANOTUBES; PLASMA; TRANSMISSION ELECTRON MICROSCOPY
Descriptors DEC
CHEMICAL COATING; COHERENT SCATTERING; DATA; DEPOSITION; DIFFRACTION; ELECTRON MICROSCOPY; ELEMENTS; INFORMATION; METALS; MICROSCOPY; NANOSTRUCTURES; NONMETALS; NUMERICAL DATA; SCATTERING; SURFACE COATING; TRANSITION ELEMENTS

Optional Information

Notes
(c) 2003 American Institute of Physics.