Published December 5, 2008 | Version v1
Journal article

Long and double hop kinetic Monte Carlo: Techniques to speed up atomistic modeling without losing accuracy

  • 1. Synopsys Inc. 700 E. Middlefield Road, 94043 Mountain View, CA (United States)
  • 2. Synopsys Switzerland LLC, Affolternstrasse 52, 8050 Zurich (Switzerland)
  • 3. Dept. Electronica. ETSIT. Universidad de Valladolid, Valladolid (Spain)

Description

According to the ITRS, the development of predictive TCAD models and simulators is one of the keystone for future CMOS technologies. The kinetic Monte Carlo (kMC) technique is particularly well placed between the poles of physical ab initio but very slow simulations, and more empirical, fast simulations by partial differential equations. Nevertheless, in other to fulfill the necessities of the semiconductor industry, faster kMC simulations would be desirable. This work shows techniques to increase the simulation speed of kMC simulations an average of 2 x while still maintaining accuracy. These techniques modify the original kMC method by using different jump distances and performing two jumps at once during the same simulation cycle. We also show the problems and limitations of these strategies, how to detect them, and how to overcome them, if possible. Finally, a comprehensive set of simulations - including amorphization, recrystallization, extended defect ripening, diffusion and activation/deactivation of several dopants used in CMOS technologies - with and without speed up techniques are compared to experimental SIMS to elucidate how reliable these techniques are

Availability note (English)

Available from http://dx.doi.org/10.1016/j.mseb.2008.08.015

Additional details

Identifiers

DOI
10.1016/j.mseb.2008.08.015;
PII
S0921-5107(08)00352-8;

Publishing Information

Journal Title
Materials Science and Engineering. B, Solid-State Materials for Advanced Technology
Journal Volume
154-155
Journal Page Range
p. 202-206
ISSN
0921-5107
CODEN
MSBTEK

Conference

Title
Symposium I: Front-end junction and contact formation in future silicon/germanium based devices
Acronym
EMRS 2008 spring meeting
Dates
26-30 May 2008
Place
Strasbourg (France)

INIS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.