Published 1979 | Version v1
Journal article

Helium-3 activation analysis of oxygen in silicon nitride films on silicon wafers

  • 1. Institute of Physical and Chemical Research, Wako, Saitama (Japan)
  • 2. Hitachi Ltd., Kokubunji, Tokyo (Japan). Central Research Lab.

Description

Oxygen in silicon nitride films on silicon wafers was analyzed by activation with the 16O(3He, p)18F reaction. By 3He bobardment of samples properly arranged considering the 18F recoil effect, total oxygen was reliably determined and its predominant part was estimated to be located whether on film surface, in film interior, or on film-substrate interface. Sample films with 0.1 to 2 μm thicknesses were found to contain 0.2 to 2 μg/cm2 of oxygen in locations varying with preparation conditions. This method has been compared with ESCA and other methods for surface analysis. (author)

Additional details

Publishing Information

Journal Title
J. Radioanal. Chem.
Journal Volume
52
Journal Issue
2
Series
J. Radioanal. Chem.
Journal Page Range
449-459
ISSN
0134-0719

Optional Information

Notes
11 refs.