Novel MEMS-based fabrication technology of micro solenoid-type inductor
- 1. National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki 305-8564 (Japan)
- 2. Meltex Inc., Saitama City, Saitama 331-0811 (Japan)
- 3. Tokyo University of Science, Noda, Chiba 278-8510 (Japan)
Description
Solenoid configuration of micro inductor, which has advantages of high quality factor and low loss, is needed in micro energy and power electronics applications but it is difficult to prepare using conventional microfabrication processes. In this work, we present a new microelectromechanical systems-based technology of micro solenoid-type inductor by a newly developed cylindrical projection photolithography method. Direct electroplating process of copper film on coil patterns was also successfully developed for achieving thick windings so that thick photoresist-based electroplating molds are not needed. Micro solenoid-type inductor prototypes of the winding pitch of about 40 µm, the winding number of 20 and 50, and the winding thickness of about 14 µm, were successfully fabricated on a 1 mm diameter glass capillary. The prepared 20-turn and 50-turn micro inductors were of inductance of 69 and 205 nH at 30 MHz, respectively. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0960-1317/23/11/114009Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Micromechanics and Microengineering. Structures, Devices and Systems
- Journal Volume
- 23
- Journal Issue
- 11
- Journal Page Range
- [8 p.]
- ISSN
- 0960-1317
- CODEN
- JMMIEZ
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47053821
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- COPPER; CYLINDRICAL CONFIGURATION; ELECTROPLATING; FABRICATION; FILMS; GLASS; INDUCTANCE; LOSSES; MEMS; MHZ RANGE 01-100; PITCHES; QUALITY FACTOR; SOLENOIDS; THICKNESS
- Descriptors DEC
- CONFIGURATION; DEPOSITION; DIMENSIONLESS NUMBERS; DIMENSIONS; ELECTRIC COILS; ELECTRICAL EQUIPMENT; ELECTRICAL PROPERTIES; ELECTRODEPOSITION; ELECTROLYSIS; ELEMENTS; EQUIPMENT; FREQUENCY RANGE; LYSIS; METALS; MHZ RANGE; ORGANIC COMPOUNDS; OTHER ORGANIC COMPOUNDS; PHYSICAL PROPERTIES; PLATING; SURFACE COATING; TRANSITION ELEMENTS