Published April 15, 1991 | Version v1
Journal article

Crack formation in epitaxial [110] thin films of YBa2Cu3O7-δ and PrBa2Cu3O7-x on [110]SrTiO3 substrates

  • 1. IBM Research Division, T.J. Watson Research Center, Yorktown Heights, New York 10598 (USA)
  • 2. Materials Department, University of California, Santa Barbara, California, 93106 (USA)

Description

A characteristic feature of epitaxial [110] thin films of YBa2Cu3O7-δ and PrBa2Cu3O7-x on [110]SrTiO3 substrates is that the films have a tendency to crack along the (001) planes. We have studied the crack spacing as a function of deposition temperature and film thickness. The experimental data have been found to be in excellent agreement with a theoretical analysis of the crack spacings in brittle films. The study has allowed us to determine the critical thickness below which no cracks are expected to form as a function of temperature for [110] films of YBa2Cu3O7-δ, PrBa2Cu3O7-x, and YBa2Cu3O7-δ/ PrBa2Cu3O7-x bilayers

Additional details

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
58
Journal Issue
15
Series
Appl. Phys. Lett.
Journal Page Range
1682-1684
ISSN
0003-6951
CODEN
APPLA