Mechanism of reverse-offset printing
Creators
- 1. Department of Printed Electronics, Korea Institute of Machinery and Materials (Korea, Republic of)
Description
We propose a mechanism for reverse-offset printing based on a mathematical model. In reverse-offset printing, high resolution is achieved by patterning a coated, thin ink film with an intaglio-patterned cliché. By using the relationships among the ink blanket adhesion strength, the ink cliché adhesion strength, and the ink cohesion strength, a criterion for successful patterning is derived. We found that there is a printing window in the ink blanket adhesion strength that depends on the shear strength of the ink film and the dimensions of the pattern. The printing window diminishes as the line width decreases, resulting in a minimum printable line width. The proposed mechanism was verified by printing patterns with various shapes and dimensions. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0960-1317/25/7/075019Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Micromechanics and Microengineering. Structures, Devices and Systems
- Journal Volume
- 25
- Journal Issue
- 7
- Journal Page Range
- [7 p.]
- ISSN
- 0960-1317
- CODEN
- JMMIEZ
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47081114
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ADHESION; FILMS; INKS; LINE WIDTHS; MATHEMATICAL MODELS; RESOLUTION; SHAPE; SHEAR PROPERTIES
- Descriptors DEC
- MECHANICAL PROPERTIES