Published April 23, 2007 | Version v1
Journal article

Topotaxial growth of Ti2AlN by solid state reaction in AlN/Ti(0001) multilayer thin films

  • 1. Thin Film Physics Division, Department of Physics, Chemistry and Biology (IFM), Linkoeping University, S-581 83 Linkoeping (Sweden)
  • 2. Institute of Ion Beam Physics and Materials Research, Forschungszentrum Dresden-Rossendorf, P.O. Box 510119, D-01314 Dresden (Germany)
  • 3. GKSS Research Center Geesthacht, Max-Planck-Str. 1, D-21502 Geesthacht (Germany)

Description

The formation of Ti2AlN by solid state reaction between layers of wurtzite-AlN and α-Ti was characterized by in situ x-ray scattering. The sequential deposition of these layers by dual magnetron sputtering onto Al2O3(0001) at 200 deg. C yielded smooth, heteroepitaxial (0001) oriented films, with abrupt AlN/Ti interfaces as shown by x-ray reflectivity and Rutherford backscattering spectroscopy. Annealing at 400 deg. C led to AlN decomposition and diffusion of released Al and N into the Ti layers, with formation of Ti3AlN. Further annealing at 500 deg. C resulted in a phase transformation into Ti2AlN(0001) after only 5 min

Additional details

Identifiers

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
90
Journal Issue
17
Journal Page Range
p. 174106-174106.3
ISSN
0003-6951
CODEN
APPLAB

Optional Information

Notes
(c) 2007 American Institute of Physics