Published 2003 | Version v1
Report

Defects analysis of silicon induced by low temperature hydrogen implantation

  • 1. Aichi Inst. of Tech., Nagoya (Japan). Faculty of Engineering
  • 2. Aichi Inst. of Tech., Nagoya (Japan). Research Institute for Industrial Technology

Description

The change of distribution of defects of silicon induced by hydrogen implantation at 109K was investigated by XTEM and DLTS (Deep Level Transient Spectroscopy) from 80K to 1400K. When the n type silicon was induced by hydrogen at 109K, many kinds of defects were observed. One of defects (EM1) was observed in detail.The total amount of defect of silicon increased with the amount of dope. The vacancy concentration peak of p type silicon was higher than n type one, which was broad and shallow. The defect layer induced by low temperature hydrogen implantation showed broad and shallow vacancy concentration. It was found that the samples with broad and shallow vacancy concentration showed blistering with low frequency. The implantation temperature affected the recovery temperature of defects by annealing. (S.Y.)

Part of:
Report on progress of researches by common utilization of JAERI nuclear facilities, for fiscal 2001

Additional details

Publishing Information

Imprint Title
Report on progress of researches by common utilization of JAERI nuclear facilities, for fiscal 2001
Imprint Pagination
172 p.
Journal Page Range
p. 26-33
Report number
UTRCN-G--31

Optional Information