Published March 5, 2017 | Version v1
Journal article

Thickness dependent growth of low temperature atomic layer deposited zinc oxide films

  • 1. CONACYT-Centro de Investigación en Materiales Avanzados S.C., Unidad Monterrey, PIIT, Apodaca, Nuevo León 66628 (Mexico)
  • 2. Instituto de Energías Renovables, Universidad Nacional Autónoma de México, Temixco, Morelos 62580 (Mexico)

Description

Highlights: • Polycrystalline columnar ZnO thin films deposited by ALD at low temperatures. • Higher deposition temperature leads to a greater surface roughness in the ALD ZnO films. • Higher temperature originates larger refractive index values of the ALD ZnO films. • ZnO thin films were denser as the numbers of ALD deposition cycles were larger. • XPS analysis revels mayor extent of the DEZ reaction during the ALD process. - Abstract: Zinc oxide films are promising to improve the performance of electronic devices, including those based on organic materials. However, the dependence of the ZnO properties on the preparation conditions represents a challenge to obtain homogeneous thin films that satisfy specific applications. Here, we prepared ZnO films of a wide range of thicknesses by atomic layer deposition (ALD) at relatively low temperatures, 150 and 175 °C. From the results of X-ray photoelectron spectroscopy, X-ray diffraction and Spectroscopic Ellipsometry it is concluded that the polycrystalline structure of the wurtzite is the main phase of the ALD samples, with OH groups on their surface. Ellipsometry revealed that the temperature and the deposition cycles have a strong effect on the films roughness. Scanning electron micrographs evidenced such effect, through the large pyramids developed at the surface of the films. It is concluded that crystalline ZnO thin films within a broad range of thickness and roughness can be obtained for optic or optoelectronic applications.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.applthermaleng.2016.09.005

Additional details

Identifiers

DOI
10.1016/j.applthermaleng.2016.09.005;
PII
S1359-4311(16)31601-5;

Publishing Information

Journal Title
Applied Thermal Engineering
Journal Volume
114
Journal Page Range
p. 1145-1151
ISSN
1359-4311
CODEN
ATENFT

Optional Information

Copyright
Copyright (c) 2016 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.