Published March 15, 2000 | Version v1
Journal article

Molecular-dynamics simulations of solid-phase epitaxy of Si: Growth mechanisms

  • 1. Advanced Technology Research Laboratories, Sumitomo Metal Industries, Ltd., Hyougo 660, (Japan)
  • 2. Department of Materials Science and Engineering, Kyushu University, Hakozaki, Fukuoka 812-8581, (Japan)

Description

Crystal-growth processes of Si during solid phase epitaxy (SPE) in the [001] direction have been investigated based on molecular-dynamics (MD) simulations using the Tersoff potential. A tetragonal cell including an amorphous/crystalline (a/c) Si interface composed of up to 4096 atoms was taken as the starting system. From the Arrhenius plot of the growth rates obtained by MD simulations, we have found that the activation energy of SPE at lower temperatures is in good agreement with the experimental value (≅2.7 eV), while it becomes lower at higher temperatures. This can be attributed to the difference in the a/c interface structure and SPE mechanism. In the low-temperature region, the a/c interface is essentially (001) and the rate-limiting step is two-dimensional nucleation on the (001) a/c interface. On the other hand, the a/c interface is predominantly composed of {111} facets in the high-temperature region and the rate-limiting step is presumably a diffusion process of Si to be trapped at the kink sites associated with these facets

Additional details

Identifiers

DOI
10.1103/PhysRevB.61.8537;
PII
S0163-1829(00)00112-0;

Publishing Information

Journal Title
Physical Review. B, Condensed Matter and Materials Physics
Journal Volume
61
Journal Issue
12
Journal Page Range
p. 8537-8540
ISSN
1098-0121

Optional Information

Notes
(c) 2000 The American Physical Society