Published August 2011
| Version v1
Journal article
Triple junction and grain boundary diffusion in the Ni/Cu system
- 1. Institute of Materials Physics, Westf. Wilhelms-Universitaet Muenster, Wilhelm-Klemm-Str. 10, D-48149 Muenster (Germany)
- 2. School of Materials Science and Engineering, University of Science and Technology Beijing, 100083 Beijing (China)
Description
Atomic transport along triple junctions (TJs) and grain boundaries (GBs) has been measured by atom probe tomography in nanocrystalline Ni/Cu bilayers. Heat treatment was chosen in the kinetic C-B regime according to generalized Harrison categories for the hierarchy of volume, GB and TJ transport. Diffusion coefficients at 623 K were found to be 4.65 x 10-20 and 1.65 x 10-17 m2 s-1 for the GB and TJ, respectively. Thus, TJs represent a significantly faster diffusion route than GBs.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.scriptamat.2011.05.002Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2011.05.002;
- PII
- S1359-6462(11)00263-6;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 65
- Journal Issue
- 4
- Journal Page Range
- p. 343-346
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 45024599
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ATOM TRANSPORT; ATOMS; COPPER; CRYSTALS; DIFFUSION; GRAIN BOUNDARIES; HEAT TREATMENTS; LAYERS; NANOSTRUCTURES; NICKEL; TEMPERATURE DEPENDENCE; TOMOGRAPHY
- Descriptors DEC
- DIAGNOSTIC TECHNIQUES; ELEMENTS; METALS; MICROSTRUCTURE; NEUTRAL-PARTICLE TRANSPORT; RADIATION TRANSPORT; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.