Published August 1, 2021 | Version v1
Journal article

Thermophysical Modeling of 20 Themis Family Asteroids with WISE/NEOWISE Observations

  • 1. CAS Key Laboratory of Planetary Sciences, Purple Mountain Observatory, Chinese Academy of Sciences, Nanjing 210023 (China)

Description

Themis family is one of the largest and oldest asteroid populations in the main belt. Water ice may widely exist on the parent body (24) Themis. In this work, we employ the Advanced Thermophysical Model as well as midinfrared measurements from NASA's Wide-field Infrared Survey Explorer to explore thermal parameters of 20 Themis family members. Here we show that the average thermal inertia and geometric albedo are 39.5 ± 26.0 J m−2 s−1/2 K−1 and 0.067 ± 0.018, respectively. The family members have a relatively moderate roughness fraction on their surfaces. We find that the relatively low albedos of Themis members are consistent with the typical values of B-type and C-type asteroids. As mentioned, the Themis family bears a very low thermal inertia, which indicates a fine and mature regolith on their surfaces. The resemblance of thermal inertia and geometric albedo of Themis members may reveal their close connection in origin and evolution. In addition, we present the compared results of thermal parameters for several prominent families.

Availability note (English)

Available from http://dx.doi.org/10.3847/1538-3881/ac01c8

Additional details

Identifiers

Publishing Information

Journal Title
Astronomical Journal (New York, N.Y. Online)
Journal Volume
162
Journal Issue
2
Journal Page Range
[17 p.]
ISSN
1538-3881

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
53077471
Subject category
S79: ASTROPHYSICS, COSMOLOGY AND ASTRONOMY; S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
Descriptors DEI
ALBEDO; ASTEROIDS; COMPUTERIZED SIMULATION; GEOMETRY; INFRARED SURVEYS; MOMENT OF INERTIA; SURFACES
Descriptors DEC
GEOLOGIC SURVEYS; GEOPHYSICAL SURVEYS; MATHEMATICS; SIMULATION