Published February 15, 2009 | Version v1
Journal article

Fabrication of microheater by laser micro cladding electronic paste

  • 1. Laser Division, Wuhan National Laboratory for Optoelectronics, School of Optoelectronics Science and Engineering, Huazhong University of Science and Technology, Wuhan, Hubei 430074 (China)

Description

The paper presents a direct-write technique named laser micro cladding electronic paste for rapid prototyping and manufacturing of microheaters. Microheaters (5 mm x 5 mm) have been successfully fabricated on alumina substrate. RuO2 thick film resistor paste was used as heating material. Thermal characterization of the microheaters has been investigated. These microheaters were suitable for a maximum long-term operation temperature of 400 deg. C. Cracking of the alumina substrate was observed at higher temperature. The heating and cooling rates of microheater were about 7 deg. C s-1 and 4 deg. C s-1, respectively. The results indicate that the microheater exhibits excellent thermal performance equivalent to those of traditional thick film screen-printed microheaters

Availability note (English)

Available from http://dx.doi.org/10.1016/j.mseb.2008.11.050

Additional details

Identifiers

DOI
10.1016/j.mseb.2008.11.050;
PII
S0921-5107(08)00618-1;

Publishing Information

Journal Title
Materials Science and Engineering. B, Solid-State Materials for Advanced Technology
Journal Volume
157
Journal Issue
1-3
Journal Page Range
p. 15-19
ISSN
0921-5107
CODEN
MSBTEK

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
40085828
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ALUMINIUM OXIDES; CLADDING; CRACKS; FABRICATION; FILMS; HEATING; LASERS; MANUFACTURING; OPERATION; RESISTORS; RUTHENIUM OXIDES
Descriptors DEC
ALUMINIUM COMPOUNDS; CHALCOGENIDES; DEPOSITION; ELECTRICAL EQUIPMENT; EQUIPMENT; OXIDES; OXYGEN COMPOUNDS; REFRACTORY METAL COMPOUNDS; RUTHENIUM COMPOUNDS; SURFACE COATING; TRANSITION ELEMENT COMPOUNDS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.