Published 1994 | Version v1
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A variable thickness window: Thermal and structural analyses

Description

In this paper, the finite difference formulations for variable thickness thermal analysis and variable thickness plane stress analysis are presented. In heat transfer analysis, radiation effects and temperature-dependent thermal conductivity are taken into account. While in thermal stress analysis, the thermal expansion coefficient is considered as temperature dependent. An application of the variable thickness window to an Advanced Photon Source beamline is presented

Availability note (English)

MF available from INIS under the Report Number; Also available from OSTI as DE94016888; NTIS; US Govt. Printing Office Dep.

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Additional details

Publishing Information

Imprint Pagination
14 p.
Report number
ANL/XFD/CP--82930

Conference

Title
International meeting on synchrotron radiation instrumentation.
Dates
18-22 Jul 1994.
Place
Stony Brook, NY (United States).

Optional Information

Contract/Grant/Project number
Contract W-31109-ENG-38
Funding organization
USDOE, Washington, DC (United States).
Secondary number(s)
CONF-940714--10.