Thermal-stress analysis and testing of DIII-D armor tiles
Description
It is planned to install about 1500 new armor tiles in the DIII-D tokamak. The armor tiles currently installed in DIII-D are made by brazing Poco AXF-5Q graphite onto Inconel X-750 stock. A small percentage of these have failed by breakage of graphite. These failures were believed to be related to significant residual stress remaining in graphite after brazing. Hence, an effort was undertaken to improve the design with all-graphite tiles. Three criteria must be satisfied by the armor tiles and the hardware used to attach the tiles to the vessel walls: tiles should not structurally fail, peak tile temperature must be less than 2500 K, and peak vessel stresses must be below acceptable levels. A number of alternate design concepts were first analyzed with the two-dimensional finite element codes TOPAZ2D and NIKE2D. Promising designs were optimized for best parameters such as thicknesses, etc. The two best designs were further analyzed for thermal stresses with the three-dimensional codes P/THERMAL and P/STRESS. Prototype tiles of a number of materials were fabricated by GA and tested at the Plasma Materials Test Facility of the Sandia National Laboratory at Albuquerque. The tests simulated the heat flux and cooling conditions in DIII-D. This paper describes the 2-D and 3-D thermal stress analyses, the test results and logic which led to the selected design of the DIII-D armor tiles. 5 refs., 7 figs., 3 tabs
Availability note (English)
MF available from INIS under the Report Number; Available from NTIS, PC A02/MF A01 - OSTI; 1 as DE89004031.
Files
Additional details
Publishing Information
- Imprint Pagination
- 8 p.
- Report number
- GA-A--18974
Conference
- Title
- 12. symposium on fusion engineering.
- Dates
- 12-16 Oct 1987.
- Place
- Monterey, CA (USA).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 20027882
- Subject category
- S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- DOUBLET-3 DEVICE; GRAPHITE; HEAT FLUX; MATERIALS TESTING; SIMULATION; STRESS ANALYSIS; TEMPERATURE DEPENDENCE; THERMAL ANALYSIS; THERMAL STRESSES; THERMONUCLEAR REACTOR MATERIAL
- Descriptors DEC
- CARBON; CLOSED PLASMA DEVICES; ELEMENTS; MATERIALS; NONMETALS; STRESSES; TESTING; THERMONUCLEAR DEVICES; TOKAMAK DEVICES
Optional Information
- Notes
- Portions of this document are illegible in microfiche products.
- Secondary number(s)
- CONF-871007--131.