Improvements in or relating to sputtering

The invention describes an electrode assembly for use in a sputtering apparatus. In the sputtering assembly, a cathode mount is insulatingly supported on an anode and carries a target rod. The target rod has a much smaller surface area than the surrounding surface of the anode. High power is supplied to the cathode so that the temperature of the target rod should reach approximately 10000C. This results in a high rate of deposition and in the deposition of a pure coating. (U.K.)