Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for CuNi bonding

Highlights: • Novel hybrid transient liquid phase sintering bonding is developed for CuNi bonding. • Fast and stable ternary (Cu,Ni)-Sn IMCs were formed by hybrid transient liquid phase sintering bonding. • Electron probe micro-analyzer was used for investigating the atomic distribution of TLPS joints. A novel approach to copper-nickel bonding was investigated by hybrid transient liquid phase sintering (TLPS) method. Hybrid bonding material containing copper, nickel, and Sn-3.0Ag-0.5Cu (SAC305) and an organic solvent was fabricated to form a fast and stable ternary CuNiSn intermetallic compound (IMC) joint between Cu to Ni joint. The atomic distribution was analyzed by an electron probe micro-analyzer, showing full IMC formation of the hybrid TLPS joint. In addition, by simultaneously adding Cu and Ni to SAC305, the IMC was stably formed, and the bonding strength of hybrid TLPS joint was the highest.