Study of physical sputtering systematics

Sputtering of solids surfaces is very important for a large number of application. For instance, the interaction particle with plasma wall in fusion device will induce the surface etching and produce the impurities. The sputtering yields for carbon and nickel solid surfaces with H+, D+, T+ and He+ projectiles at normal incidence were calculated. The sputtering yields for many projectile-target combination from threshold energy to about 100 KeV at normal incidence are computed further. The sputtering yields of Si by various projectiles and the sputtering yields of various targets by H+ are presents. The sputtering systematics is discussed from calculated results. (2 figs.)