Published October 9, 2006 | Version v1
Journal article Metadata-only

On the deposition rate in a high power pulsed magnetron sputtering discharge

Creators

  • 1. Institute of Physics (IA), RWTH Aachen University, 52056 Aachen (Germany)
  • 2. MELEC GmbH, 77833 Ottersweier (Germany)

Description

The effect of the high pulse current and the duty cycle on the deposition rate in high power pulsed magnetron sputtering (HPPMS) is investigated. Using a Cr target and the same average target current, deposition rates are compared to dc magnetron sputtering (dcMS) rates. It is found that for a peak target current density ITpd of up to 570 mA cm-2, HPPMS and dcMS deposition rates are equal. For ITpd>570 mA cm-2, optical emission spectroscopy shows a pronounced increase of the Cr+/Cr0 signal ratio. In addition, a loss of deposition rate, which is attributed to self-sputtering, is observed

Additional details

Identifiers

DOI
10.1063/1.2362575;

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
89
Journal Issue
15
Journal Page Range
p. 154104-154104.3
ISSN
0003-6951
CODEN
APPLAB

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
38023964
Subject category
S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
Descriptors DEI
CHROMIUM; CHROMIUM IONS; CURRENT DENSITY; DEPOSITION; EMISSION SPECTROSCOPY; PLASMA; PLASMA DIAGNOSTICS; PULSES; SPUTTERING; THIN FILMS
Descriptors DEC
CHARGED PARTICLES; ELEMENTS; FILMS; IONS; METALS; SPECTROSCOPY; TRANSITION ELEMENTS

Optional Information

Notes
(c) 2006 American Institute of Physics