Numerical Simulation of Thermodynamic Parameters of High-Porosity Copper
Creators
- 1. Lavrent'ev Institute of Hydrodynamics, Siberian Branch, Russian Academy of Sciences (Russian Federation)
Description
We propose that a modified equation of state be used for calculating the thermodynamically equilibrium TEC2 model for improving the reliability of description of thermodynamic parameters of shock loading of pure materials and heterogeneous mixtures of various porosities. For copper, the parameters of a thermally consistent equation of state have been determined. A reliable description of shock-wave loading of copper has been obtained using a small number of fitting parameters determined from the concordance with experimental data. Thermodynamic parameters have been simulated for copper with various porosities; the compression ratio and the temperature along the shock adiabat have been determined, and the value of heat capacity along the normal isobar has been calculated. The results of calculations are compared with available experimental results obtained by different authors.
Additional details
Identifiers
Publishing Information
- Journal Title
- Technical Physics
- Journal Volume
- 64
- Journal Issue
- 8
- Journal Page Range
- p. 1090-1095
- ISSN
- 1063-7842
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 51091582
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Numerical Data
- Descriptors DEI
- COMPRESSION RATIO; COMPUTERIZED SIMULATION; COPPER; DYNAMIC LOADS; EQUATIONS OF STATE; EXPERIMENT RESULTS; EXPERIMENTAL DATA; MIXTURES; POROSITY; SHOCK WAVES; SPECIFIC HEAT; THERMODYNAMICS
- Descriptors DEC
- DATA; DIMENSIONLESS NUMBERS; DISPERSIONS; ELEMENTS; EQUATIONS; INFORMATION; METALS; NUMERICAL DATA; PHYSICAL PROPERTIES; SIMULATION; THERMODYNAMIC PROPERTIES; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2019 Pleiades Publishing, Ltd.