Dissolution of thin TaV2 during annealing of Ta/TaV2/V tri-layer below the order-disorder temperature
- 1. Institute for Nuclear Research, Hungarian Academy of Sciences (Atomki), Debrecen (Hungary)
- 2. Physics Department, Faculty of Education, Ain Shams University, Roxy, Cairo (Egypt)
- 3. Department of Solid State Physics, Faculty of Science and Technology, University of Debrecen, H-4010 Debrecen (Hungary)
Description
In this research, we provide first experimental evidence on the dissolution of a thin compound layer sandwiched between the parent materials when it is heated below the order-disorder temperature. The Ta(10 nm)/TaV2(6 nm)/V(30 nm) system, prepared by DC magnetron sputtering, has been chosen to prove the expected simulation results. The samples were investigated mainly by secondary neutral mass spectrometry. The about 6 nm thick TaV2 compound layer was dissolved by annealing at 1025 °C for 1 h. Then, it was reformed by increasing the annealing time to 2–3 h. These results prove our previous computer kinetic Monte Carlo and Kinetic mean field calculations. These findings are important for nanotechnologies utilizing early stages of solid state reactions.
Additional details
Identifiers
- DOI
- 10.1016/j.apsusc.2018.10.013;
- PII
- S0169433218327107;
Publishing Information
- Journal Title
- Applied Surface Science
- Journal Volume
- 466
- Journal Page Range
- p. 381-384
- ISSN
- 0169-4332
- CODEN
- ASUSEE
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 55040617
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- COMPUTERIZED SIMULATION; DISSOLUTION; KINETICS; LAYERS; MAGNETRONS; MASS SPECTROSCOPY; MEAN-FIELD THEORY; MONTE CARLO METHOD; NANOTECHNOLOGY; SOLIDS
- Descriptors DEC
- CALCULATION METHODS; ELECTRON TUBES; ELECTRONIC EQUIPMENT; EQUIPMENT; MICROWAVE EQUIPMENT; MICROWAVE TUBES; SIMULATION; SPECTROSCOPY
Optional Information
- Copyright
- Copyright (c) 2018 Elsevier B.V. All rights reserved.