Published February 2008 | Version v1
Journal article

Microstructure of CoNiFeB electroless-deposited soft magnetic underlayer for perpendicular recording media

  • 1. National Institute for Material Science, 1-2-1 Sengen, Tsukuba 305-0047 (Japan)
  • 2. Shin-Etsu Chemical Co., Ltd., Takefu-shi, Fukui 915 (Japan)

Description

The microstructure of a CoNiFeB film for a soft magnetic underlayer of perpendicular recording media, which was deposited by electroless plating on a Si wafer, has been investigated by transmission electron microscopy and a three-dimensional atom probe. After the deposition of the CoNiFeB film on a Ni underlayer, Hc decreased from about 62 to about 3 Oe. Based on the microstructure observation results, the decrease of Hc was concluded to be the result of reduced magneto-elastic energy. The good adhesiveness between the soft underlayer (SUL) and the Si substrate was found to be due to the composition gradient

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jmmm.2007.07.007

Additional details

Identifiers

DOI
10.1016/j.jmmm.2007.07.007;
PII
S0304-8853(07)00808-6;

Publishing Information

Journal Title
Journal of Magnetism and Magnetic Materials
Journal Volume
320
Journal Issue
3-4
Journal Page Range
p. 490-495
ISSN
0304-8853
CODEN
JMMMDC

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
39063972
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
BORON ALLOYS; COBALT ALLOYS; FILMS; IRON ALLOYS; MICROSTRUCTURE; NICKEL ALLOYS; PLATING; TRANSMISSION ELECTRON MICROSCOPY
Descriptors DEC
ALLOYS; DEPOSITION; ELECTRON MICROSCOPY; MICROSCOPY; SURFACE COATING; TRANSITION ELEMENT ALLOYS

Optional Information

Copyright
Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.