Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique

The thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films are studied in this paper. Several types of adhesion layers were investigated: 10.0 nm Pt, 1.5 nm Cr + 50.0 nm Pt, 2.5 nm Cr + 50.0 nm Pt and 3.5 nm Cr + 50.0 nm Pt fabricated using direct current magnetron sputtering. The variation of layer thickness, roughness, crystallization and surface topography of Pt/Cr films were analyzed by grazing incidence X-ray reflectometry, large angle X-ray diffraction and optical profiler before and after heating. 2.5 nm Cr + 50.0 nm Pt film exhibits the best thermal stability and separation characteristics according to the heating and hot slumping experiments. The film was also applied as an anti-sticking layer to optimize the maximum temperature of the hot slumping technique. (authors)