Published June 1, 2001 | Version v1
Journal article

Enhancement of metal - semiconductor barrier height with superthin silicon dioxide films deposited on gallium arsenide by liquid phase deposition

Creators

Description

This study presents a method for surface passivation using silicon dioxide (SiO2). The proposed method has shown great effectiveness on metal - semiconductor barrier height enhancement. A high quality SiO2 layer is developed via liquid phase deposition, a method which naturally leaves a doping-level fluorine residue in the SiO2. The addition of fluorine to enhance the Schottky barrier height (SBH) is first discussed. Experimental results are presented. It is found that this fluorine addition enhances the Schottky barrier height, which allows a larger positive gate bias for enhancement mode metal - semiconductor field-effect transistors, thus permitting the fabrication of digital logic circuits with improved noise margins and relaxed tolerance with regard to device threshold voltage uniformity. The SBH to n-gallium arsenide (GaAS) is found to be approximately 0.7 eV. Finally, the effective barrier height of the metal - insulator - semiconductor structure reached 1.03 eV after annealing. The enhancement of SBH has been attributed to the formation of these stable interface layers. A model for fluorine-enhanced SiO2 SBH enhancement is also presented. [copyright] 2001 American Institute of Physics

Additional details

Identifiers

Publishing Information

Journal Title
Journal of Applied Physics
Journal Volume
89
Journal Issue
11
Series
The American Physical Society
Journal Page Range
p. 6501-6505
ISSN
0021-8979

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
32055691
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ARSENIDES; DEPOSITION; FLUORINE ADDITIONS; GALLIUM ARSENIDES; LOGIC CIRCUITS; SILICON
Descriptors DEC
ARSENIC COMPOUNDS; ARSENIDES; ELECTRONIC CIRCUITS; ELEMENTS; GALLIUM COMPOUNDS; PNICTIDES; SEMIMETALS

Optional Information

Notes
Othernumber: JAPIAU000089000011006501000001; 057110JAP
Funding organization
(United States)