Atomic-scale structural evolution and welding deformations of laser welded joints in Ag nanowire connectors on homogeneous substrates
- 1. Center for Photonics and Semiconductors, School of Power and Mechanical Engineering, Wuhan University, Wuhan (China)
Description
The formation mechanism and the influence of laser power on welding deformations of welded joints in Ag nanowire connectors were investigated using molecular dynamic simulations. Simulation results revealed that some regions of voids in the welded joint were filled due to the heat in the heat affected zone. The laser irradiation with the appropriate power can decrease dislocations and phase transitions generated by cold welding. The welding strength possessed an upward trend with the increase in laser power. With the increase of the laser power, the shear resistance of the welded joint improved. However, the welded joint after the laser with the excessive power weakened. Furthermore, by comparing the laser welding and the thermal annealing welding, we found that the laser welded joint possesses fewer amorphous atoms, phase transitions, dislocations, residual stress, and possibility of the shear deformation via simulation. (author)
Availability note (English)
Available from DOI: https://doi.org/10.35848/1347-4065/abc02bAdditional details
Identifiers
Publishing Information
- Journal Title
- Japanese Journal of Applied Physics (Online)
- Journal Volume
- 59
- Journal Issue
- 11
- Journal Page Range
- p. 115002.1-115002.11
- ISSN
- 1347-4065
INIS
- Country of Publication
- Japan
- Country of Input or Organization
- Japan
- INIS RN
- 52090496
- Subject category
- S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- BOLTZMANN STATISTICS; COMPUTERIZED SIMULATION; CONNECTORS; COORDINATION NUMBER; DEFORMATION; DISTRIBUTION FUNCTIONS; ELECTRON DENSITY; LASER WELDING; LIGHT EMITTING DIODES; MOLECULAR DYNAMICS METHOD; NANOWIRES; RESIDUAL STRESSES; THERMOSTATS; WELDED JOINTS
- Descriptors DEC
- CALCULATION METHODS; CONDUCTOR DEVICES; CONTROL EQUIPMENT; ELECTRICAL EQUIPMENT; EQUIPMENT; FABRICATION; FUNCTIONS; JOINING; JOINTS; NANOSTRUCTURES; SEMICONDUCTOR DEVICES; SEMICONDUCTOR DIODES; SIMULATION; STRESSES; WELDING
Optional Information
- Notes
- 50 refs., 14 figs., 1 tab.