Electronic structure of topological insulators with MM′X half-Heusler compounds using density functional theory
Creators
- 1. School of Materials Science and Engineering, China Jiliang University, Hangzhou 330018 (China)
- 2. Key Laboratory of Automobile Materials (Jilin University), Ministry of Education, and School of Materials Science and Engineering, Jilin University, Changchun 130022 (China)
Description
The band structures and partial density of states of MM′X half-Heusler compounds as topological insulators have been simulated by using local density approximate + U. Results show that both the covalent M′–X bonds and the ionic M–M′ bands contribute the band structures, and the covalent bonds between M′ and X atoms decide the number of (EΓ6 − EΓ8) (Γ6 and Γ8 denote the twofold s-type orbitals and fourfold p-type orbitals and M, M′, and X show atoms located at different positions in the lattice); big size of |χM′ − χX| and small value of V are propitious to form topological insulators. - Highlights: • Both of covalent M′–X bonds and ionic M–M′ bands contribute band structures. • The covalent M′–X bonds decide the number of (EΓ6 − EΓ8). • Big value of |χM′ − χX| and small value of V are propitious to form topological insulators
Availability note (English)
Available from http://dx.doi.org/10.1016/j.tsf.2013.04.066Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2013.04.066;
- PII
- S0040-6090(13)00702-5;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 546
- Journal Page Range
- p. 436-438
- ISSN
- 0040-6090
- CODEN
- THSFAP
Conference
- Title
- International Union of the Materials Research Society international conference in Asia
- Acronym
- IUMRS-ICA 2012
- Dates
- 26-31 Aug 2012
- Place
- Busan (Korea, Republic of)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 46128423
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ATOMS; CHEMICAL BONDS; COMPUTERIZED SIMULATION; COVALENCE; DENSITY FUNCTIONAL METHOD; DENSITY OF STATES; DIELECTRIC MATERIALS; ELECTRONEGATIVITY; ELECTRONIC STRUCTURE; HEUSLER ALLOYS; TOPOLOGY
- Descriptors DEC
- ALLOYS; ALUMINIUM ALLOYS; CALCULATION METHODS; COPPER ALLOYS; COPPER BASE ALLOYS; CORROSION RESISTANT ALLOYS; MANGANESE ALLOYS; MATERIALS; MATHEMATICS; SIMULATION; TRANSITION ELEMENT ALLOYS; VARIATIONAL METHODS
Optional Information
- Copyright
- Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.