Published November 1, 2013 | Version v1
Journal article

Electronic structure of topological insulators with MM′X half-Heusler compounds using density functional theory

  • 1. School of Materials Science and Engineering, China Jiliang University, Hangzhou 330018 (China)
  • 2. Key Laboratory of Automobile Materials (Jilin University), Ministry of Education, and School of Materials Science and Engineering, Jilin University, Changchun 130022 (China)

Description

The band structures and partial density of states of MM′X half-Heusler compounds as topological insulators have been simulated by using local density approximate + U. Results show that both the covalent M′–X bonds and the ionic M–M′ bands contribute the band structures, and the covalent bonds between M′ and X atoms decide the number of (EΓ6 − EΓ8) (Γ6 and Γ8 denote the twofold s-type orbitals and fourfold p-type orbitals and M, M′, and X show atoms located at different positions in the lattice); big size of |χM′ − χX| and small value of V are propitious to form topological insulators. - Highlights: • Both of covalent M′–X bonds and ionic M–M′ bands contribute band structures. • The covalent M′–X bonds decide the number of (EΓ6 − EΓ8). • Big value of |χM′ − χX| and small value of V are propitious to form topological insulators

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2013.04.066

Additional details

Identifiers

DOI
10.1016/j.tsf.2013.04.066;
PII
S0040-6090(13)00702-5;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
546
Journal Page Range
p. 436-438
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
International Union of the Materials Research Society international conference in Asia
Acronym
IUMRS-ICA 2012
Dates
26-31 Aug 2012
Place
Busan (Korea, Republic of)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
46128423
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ATOMS; CHEMICAL BONDS; COMPUTERIZED SIMULATION; COVALENCE; DENSITY FUNCTIONAL METHOD; DENSITY OF STATES; DIELECTRIC MATERIALS; ELECTRONEGATIVITY; ELECTRONIC STRUCTURE; HEUSLER ALLOYS; TOPOLOGY
Descriptors DEC
ALLOYS; ALUMINIUM ALLOYS; CALCULATION METHODS; COPPER ALLOYS; COPPER BASE ALLOYS; CORROSION RESISTANT ALLOYS; MANGANESE ALLOYS; MATERIALS; MATHEMATICS; SIMULATION; TRANSITION ELEMENT ALLOYS; VARIATIONAL METHODS

Optional Information

Copyright
Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.