Published July 28, 1987 | Version v1
Patent

Cubic boron nitride preparation

Description

A method is described for deposition of cubic boron nitride on a substrate, which method comprises the steps of: (a) supporting a substrate on an rf biased electrode in a near vacuum at a base pressure below approximately 30 x 10/sup -6/ torr where oxygen levels in deposited coatings are restricted to below 20 atomic percent, (b) heating the substrate to at least 1300C, (c) introducing a noble gas to a partial pressure not exceeding 20 x 10/sup -3/ torr; (d) introducing nitrogen to a partial pressure not exceeding 5 x 10/sup -3/ torr, (e) cathodically sputtering a BN source, (f) during cathodic sputtering of the BN source, cathodically sputtering a metal dopant source consisting of a metal selected from Groups IA, IVA, VA, VIIA, IB, IIB, IIIB, IVB, and VB of the periodic table such that dopant is deposited at less than 1.5 atomic percent. A cubic boron nitride coating is deposited on the substrate

Availability note (English)

U.S. Commissioner of Patents, Washington, D.C. 20231, USA, $.50.

Additional details

Publishing Information

Imprint Pagination
vp.
IPC:
Int. Cl. C23C 14/34.
IPC
Int. Cl. C23C 14/34.
Patent number
US patent document 4,683,043/A/